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Photonics in the Package for Extreme Scalability (PIPES)

General Information

Document Type:MOD
Posted Date:Dec 21, 2018
Category: Research and Development
Set Aside:N/A

Contracting Office Address

675 North Randolph Street <br> Arlington, VA 22203

Description

Amendment 02: The purpose of this amendment is to extend the proposal due date. Original Synopsis below. The DARPA Microsystems Technology Office is soliciting research proposals for the development of package-level optical signaling technologies for advanced microelectronic systems to enable disruptive performance scaling through parallelism. NOTE: THIS NOTICE WAS NOT POSTED TO FEDBIZOPPS ON THE DATE INDICATED IN THE NOTICE ITSELF (21-DEC-2018); HOWEVER, IT DID APPEAR IN THE FEDBIZOPPS FTP FEED ON THIS DATE. PLEASE CONTACT 877-472-3779 or fbo.support@gsa.gov REGARDING THIS ISSUE.

Original Point of Contact

POC BAA Coordinator

Place of Performance

Link: Link To Document
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